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3
Absolute Maximum Ratings, Ta = +25C, Single Diode
Symbol PT PIV TJ TSTG TOP Parameter Total Device Dissipation[2] Peak Inverse Voltage Junction Temperature Storage Temperature Operating Temperature Absolute Maximum[1] HSMS-285x 75 mW 2.0 V 150C -65C to 150C -65C to 150C HSMS-286x 250 mW 4.0 V 150C -65C to 150C -65C to 150C
Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. CW Power Dissipation at TLEAD = +25C. Derate linearly to zero at maximum rated temperature. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
Equivalent Circuit Model
HSMS-2850, HSMS-2860; Singles
0.08 pF
SPICE Parameters
Parameter BV CJ0 EG IBV Units V pF eV A A V HSMS-285X 3.8 0.18 0.69 3 x 10E-4 3 x 10E-6 1.06 25 0.35 2 0.5 HSMS-286X 7.0 0.18 0.69 10E-5 5.0 x 10E-8 1.08 5.0 0.65 2 0.5
2 nH
RS
Rj
IS N RS PB (VJ) PT (XTI)
0.18 pF RS = series resistance (see Table of SPICE parameters) Rj = 8.33 X 10-5 nT Ib + I s
M
where Ib = externally applied bias current in amps Is = saturation current (see table of SPICE parameters) T = temperature, K n = identity factor (see table of SPICE parameters)
4
Typical Parameters, Single Diode
FORWARD VOLTAGE DIFFERENCE (mV)
100
100
100
10 IF (left scale)
IF - FORWARD CURRENT (mA)
FORWARD CURRENT (mA)
10
10
TA = +85C TA = +25C TA = -55C
1
1
FORWARD CURRENT (A)
10
0.1
.1
VF (right scale)
0.01
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VF - FORWARD VOLTAGE (V)
.01 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 FORWARD VOLTAGE (V)
1 0.05
0.10
0.15
0.20
1 0.25
FORWARD VOLTAGE (V)
Figure 1. Typical Forward Current vs. Forward Voltage, HSMS-2850 Series.
Figure 2. Typical Forward Current vs. Forward Voltage at Temperature, HSMS-2860 Series.
30
Figure 3. Typical Forward Voltage Match, HSMS-2860 Pairs.
10000 RL = 100 K 1000
10,000
RL = 100 K 915 MHz
20 A
VOLTAGE OUT (mV)
VOLTAGE OUT (mV)
VOLTAGE OUT (mV)
2.45 GHz 100 915 MHz
10 2.45 GHz
10 A 1000 5 A 100 Frequency = 2.45 GHz Fixed-tuned FR4 circuit 10 RL = 100 K
10 5.8 GHz
DIODES TESTED IN FIXED-TUNED FR4 MICROSTRIP CIRCUITS.
5.8 GHz 1
DIODES TESTED IN FIXED-TUNED FR4 MICROSTRIP CIRCUITS.
1
0.1 -50
-40
-30
-20
-10
0
0.3 -50
-40 POWER IN (dBm)
-30
1 -40
-30
-20
-10
0
10
POWER IN (dBm)
POWER IN (dBm)
Figure 4. +25C Output Voltage vs. Input Power, HSMS-2850 at Zero Bias, HSMS-2860 at 3 A Bias.
Figure 5. +25C Expanded Output Voltage vs. Input Power. See Figure 4.
Figure 6. Dynamic Transfer Characteristic as a Function of DC Bias, HSMS-2860.
40 35
3.1 2.9 2.7 2.5 2.3 2.1 1.9 1.7 1.5 1.3 1.1 FR4 MICROSTRIP CIRCUIT. 0.9 0 10 20 30 40 50 60 70 80 90 100 TEMPERATURE (C)
MEASUREMENTS MADE USING A
OUTPUT VOLTAGE (mV)
30 25 20 15 10 5 .1 Input Power = -30 dBm @ 2.45 GHz Data taken in fixed-tuned FR4 circuit RL = 100 K 1 10 100 BIAS CURRENT (A)
Figure 7. Voltage Sensitivity as a Function of DC Bias Current, HSMS-2860.
OUTPUT VOLTAGE (mV)
FREQUENCY = 2.45 GHz PIN = -40 dBm RL = 100 K
Figure 8. Output Voltage vs. Temperature, HSMS-2850 Series.
Applications Information
See the HSMS-285A data sheet.
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Ordering Information
Specify part number followed by option. For example: H SMS - 285X #X XX Bulk or Tape and Reel Option Profile: Low = L Part Number Surface Mount Schottky Hewlett-Packard
Profile Option Descriptions
#L30 = Bulk #L31 = 3K pc. Tape and Reel, Device Orientation Figures 9, 10 Tape and Reeling conforms to Electronic Industries RS-481, "Taping of Surface Mounted Components for Automated Placement."
Package Dimensions Outline 23 (SOT-23)
1.02 (0.040) 0.89 (0.035) 0.54 (0.021) 0.37 (0.015) 3 1.40 (0.055) 1.20 (0.047) 2 2.65 (0.104) 2.10 (0.083)
PACKAGE MARKING CODE
XX
1 0.50 (0.024) 0.45 (0.018)
2.04 (0.080) 1.78 (0.070) TOP VIEW 0.152 (0.006) 0.066 (0.003) 1.02 (0.041) 0.85 (0.033)
3.06 (0.120) 2.80 (0.110)
0.10 (0.004) 0.013 (0.0005) SIDE VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.69 (0.027) 0.45 (0.018) END VIEW
Outline 143 (SOT-143)
0.92 (0.036) 0.78 (0.031) PACKAGE MARKING CODE E XX B E 0.54 (0.021) 0.37 (0.015) C 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083)
0.60 (0.024) 0.45 (0.018) 2.04 (0.080) 1.78 (0.070) 3.06 (0.120) 2.80 (0.110)
0.15 (0.006) 0.09 (0.003) 1.02 (0.041) 0.85 (0.033) 0.10 (0.004) 0.013 (0.0005) DIMENSIONS ARE IN MILLIMETERS (INCHES) 0.69 (0.027) 0.45 (0.018)
Package Characteristics
Lead Material Lead Finish Max. Soldering Temp. Min. Lead Strength Typical Package Inductance Typical Package Capacitance Alloy 42 Tin-Lead 85/15% 260C for 5 sec. 2 pounds pull 2 nH (opposite leads) 0.08 pF (opposite leads)
Device Orientation
REEL
CARRIER TAPE USER FEED DIRECTION COVER TAPE
TOP VIEW 4 mm
END VIEW
4 mm
8 mm
8 mm
Figure 9. Option L31 for SOT-23 Packages.
Figure 10. Option L31 for SOT-143 Packages.
www.hp.com/go/rf For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright (c) 1998 Hewlett-Packard Co. Obsoletes 5966-0928E, 5966-2939E Printed in U.S.A. 5966-4283E (3/98)

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